American Superconductor has been granted a patent for a method of making a laminated superconductor wire. The method involves affixing a high temperature superconductor layer to a biaxially textured substrate, removing the substrate, and affixing cap layers and lamination layers. The patent also includes the reuse of the removed substrate to deposit a second high temperature superconductor layer. GlobalData’s report on American Superconductor gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on American Superconductor, bi-directional power converter was a key innovation area identified from patents. American Superconductor's grant share as of June 2023 was 1%. Grant share is based on the ratio of number of grants to total number of patents.
Patent granted for a method of making laminated superconductor wire
A recently granted patent (Publication Number: US11657930B2) describes a method for producing a laminated superconductor wire. The method involves several steps, including providing a superconductor insert with a high-temperature superconductor layer and a conductive cap layer. The cap layer is affixed to a stabilizer layer, and the biaxially textured substrate is removed from the superconductor layer. The removed substrate is collected on a reel for reuse. A second conductive cap layer is then affixed to the superconductor layer, followed by the attachment of lamination layers to the cap layer and stabilizer layer. The lamination layers are connected to the superconductor wire assembly through fillets.
The patent also specifies the materials used in the process. The high-temperature superconductor layers consist of a rare earth-alkaline earth-copper oxide. The biaxially textured substrate can be made of hastelloy or a nickel alloy, and may include buffer layers. The conductive cap layers are composed of silver or a silver alloy, or a combination of silver and copper. The lamination layers can be made of various metals, including aluminum, copper, silver, nickel, iron, stainless steel, and their respective alloys. The width of the lamination layers is greater than that of the superconductor layer, typically between 0.01 and 2 mm wider. The stabilizer layer is also made of various metals and alloys. The attachment of the cap layer to the stabilizer layer, as well as the bonding of the lamination layers, is achieved using epoxy or solder. The fillets are also formed using epoxy or solder.
This patented method offers a technique for producing laminated superconductor wires with improved performance and efficiency. By utilizing a reel-to-reel process and reusing the biaxially textured substrate, the method reduces material waste and production costs. The use of specific materials for the superconductor layers, cap layers, lamination layers, and stabilizer layer ensures optimal conductivity and structural integrity. The fillets provide secure connections between the lamination layers and the superconductor wire assembly. Overall, this patented method presents a practical and effective approach to manufacturing laminated superconductor wires.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
